The SRI electronic engineering team has developed electronics for medical devices, military, telecommunications, industrial and consumer products. The EE team has experience with the following microprocessor families: Cold Fire, TMS320, 8051, Pentium, 68000, and 68332.

The SRI Product Development electronic engineering team refines the system requirements allocated to the electronics to produces an ERS (electronics requirement specification). In parallel the EE team works with the system engineering team and the software team to develop a system block diagram. The EE team works with the ME and ID teams on the generation of the Bill Of Materials.

The SRI EE team generates schematic diagrams for both prototype and production systems. Once the schematic has been approved, the board layout process is executed. Once the board layout process is complete, the board fabrication process is started. Fabricated PCB boards are assembled by SRI electronic technicians who are capable of soldering surface mount parts. The assembled board is first tested by the electronic engineer, and then taken through electronics and software "board bringup".After these activities are complete, the board is ready to be deployed in the system.

The SRI EE team has experience in FPGA/CPLD design, develoopment, and test. The team has experience with FPGA vendors such as Altera and Xilinx. The SRI EE team uses VHDL to program the behavior of the FPGA. In addition test bench simulations are also generated to test the logic prior to deploying the design.

In summary, the SRI EE team performs the following activities during the course of a typical project:

• Requirements Definition
• Schematic Capture
• Board Layout
• PCB Assembly
• Design Verification
• Design for manufacturability
• Compliance Engineering
• FPGA Design
• Synthesis
• Simulation
• Test